TY  JOUR
TI  Multiphysical modeling of microelectronic systems with heterogeneous integration
KW  Heterogeneous integration
KW  multiphysics modeling
KW  thermal processes
KW  mechanical stresses
KW  electromagnetic modeling
KW  redistribution layers (RDL)
KW  coefficient of thermal expansion (CTE)
KW  high-density interconnects
KW  3D integration
KW  and reliability of microelectronic systems.
JO  Modeling of systems and processes
AU  Achkasov, A.V.
AU  Yagodkin, A.S.
AU  Makarenko, F.V.
PY  2025
IS  18
PB  FSBE Institution of Higher Education Voronezh State University of Forestry and Technologies named after G.F. Morozov