AO "Nauchno-issledovatel'skiy institut elektronnoy tehniki"
Russian Federation
UDK 621.3 Электротехника
This review article discusses methods for measuring the main mechanical properties of thin films: tensile testing, indentation, evaluation of the mechanical strength margin for the curvature of the plate-thin film system, bulge method and research using a deformed and resonant cantilever. In the process of critical analysis of domestic and foreign literary sources, the advantages and disadvantages of the methods were revealed; the authors' motivation for conducting such studies was explained. In addition to the existing widely used methods, an original and relatively new technique is given - the use of electric current as a controlled means of applying thermo mechanical stresses to electrical conductors to characterize their fatigue behavior. Approaches for increasing the mechanical strength of thin films are also indicated.
Mechanical properties, strength, yield strength, mechanical stresses, Young's modulus, grain size, material fatigue, thin films, defects, deformation, MEMS
1. Technique for Analyzing Volumetric Defects Using Digital Elevation Model of a Surface / A.A. Dedkova, I.V. Florinsky, E.E. Gusev [et. al.] // Russian Journal of Nondestructive Testing. - 2021. - Vol. 57(11). - Pp. 1000-1007. - DOI:https://doi.org/10.31857/S01303082211100.
2. Fonseca, D.J. On MEMS Reliability and Failure Mechanisms / D.J. Fonseca, M. Sequera // International Journal of Quality, Statistics and Reliability. - 2011. - P. 1-7. - DOI:https://doi.org/10.1155/2011/820243.
3. Microelectromechanical System Sensor Market by Type and Application: Global Opportunity Analysis and Industry Forecast, 2019-2026, Allied Market Research. - URL: Microelectromechanical System Market by Type, and Application: Global Opportunity Analysis and Industry Forecast, 2019-2026 (researchandmarkets.com) (data obrascheniya: 07.07.2022).
4. Microelectromechanical Systems for Nanomechanical Testing: Electrostatic Actuation and Capacitive Sensing for High-Strain-Rate Testing / C. Li, D. Zhang, G. Cheng, Y. Zhu // Experimental Mechanics. - 2020. - Vol. 60. - P. 329-343. - DOI:https://doi.org/10.1007/s11340-019-00565-5.
5. Khan, N. Design and development of a MEMS butterfly resonator using synchronizing beam and out of plane actuation / N. Khan, M.J. Ahamed // Microsystem Technologies. - 2020. - Vol. 26. - Pp. 1643-1652. - DOI:https://doi.org/10.1007/s00542-019-04705-8.
6. Thermal Management Using MEMS Bimorph Cantilever Beams / R.A. Coutu Jr, R.S. LaFleur, J.P.K. Walton [et al.] // Experimental Mechanics. - 2016. - Vol. 56. -Pp. 1293-1303. - DOI:https://doi.org/10.1007/s11340-016-0170-1.
7. Size Effects of Hardness and Strain Rate Sensitivity in Amorphous Silicon Measured by Nanoindentation / D.M. Jarząbek, M. Milczarek, S. Nosewicz [et al.] // Metall Mater Trans A. - 2020. - Vol. 51. - Pp. 1625-1633. - DOI:https://doi.org/10.1007/s11661-020-05648-w.
8. Rosenmayer, C.T. Mechanical Testing of Thin Films / C.T. Rosenmayer, F.R. Brotzen, R.J. Gale // MRS Online Proceedings Library. - 1988. - Vol. 130. - Pp. 77-86. - DOI:https://doi.org/10.1557/PROC-130-77.
9. Brotzen, F.R. Mechanical testing of thin films / F.R. Brotzen, S. Moore // International Materials Reviews. - 1994. - Vol. 39. Pp. 24-45. - DOI:https://doi.org/10.1179/095066094790150973.
10. Tensile Properties of FreeStanding Aluminum Thin Films / D.T. Read, Y.W. Cheng, R.R. Keller, J.D. McColskey // Scripta Materialia.- 2001. - Vol. 45 (5). - Pp. 583-589.
11. A New Method for Tensile Testing of Thin Films / J.A. Ruud, D. Josell, F. Spaepen, A.L. Greer // Journal of Materials Research. - 1993. - Vol. 8(1). - Pp. 112-117. - DOI:https://doi.org/10.1017/S0884291400120412.
12. Espinosa, H.D. Plasticity Size Effects in Free-Standing Submicron Polycrystalline FCC Films Subjected to Pure Tension / H.D. Espinosa, B.C. Prorok, B. Peng // Journal of the Mechanics and Physics of Solids. - 2004. - Vol. 52(3). - Pp. 667-689. - DOI:https://doi.org/10.1016/J.JMPS.2003.07.001.
13. Haque, M.A. Deformation Mechanisms in Free-Standing Nanoscale Thin Films: A Quantitative in situ Transmission Electron Microscope Study / M.A. Haque, M.T.A. Saif // Proceedings of the National Academy of Sciences of the United States of America. - 2004. - Vol. 101(17). - Pp. 6335-6340. - DOI:https://doi.org/10.1073/PNAS.0400066101.
14. Ruoff, A.L. The Fracture and Yield Strengths of Diamond, Silicon and Germanium / Ruoff, A.L. // High-Pressure Science and Technology. Springer, Boston, MA, 1979. - Pp. 1557-1580. - DOI:https://doi.org/10.1007/978-1-4684-7470-1_194.
15. Vanlandingham, M.R. Review of Instrumented Indentation / M.R. Vanlandingham // Journal of Research of the National Institute of Standards and Technology. - 2003. - Vol. 108(4). - Pp. 249-265. - DOI:https://doi.org/10.6028/jres.108.024.
16. Marchesini, O. Vickers Indentation Curves of Magnesium-Oxide (MgO) / O. Marchesini, G. Meille // Journal of Tribology-Transactions of the ASME. - 1984. - Vol. 106(1). - Pp. 43-48. - DOI:https://doi.org/10.1115/1.3260865.
17. Doerner, M.F. A Method for Interpreting the Data from Depth-Sensing Indentation Measurements / M.F. Doerner, W.D. Nix // Journal of Materials Research. - 1986. - Vol. 1(4). - Pp. 601-616. - DOI:https://doi.org/10.1557/JMR.1986.0601.
18. Oliver, W.C. An Improved Technique for Determining Hardness and Elastic-Modulus Using Load and Displacement Sensing Indentation Experiments / W.C. Oliver, G.M. Pharr // Journal of Materials Research. - 1992. - Vol. 7(6). - Pp. 1564-1583. - DOI:https://doi.org/10.1557/JMR.1992.1564.
19. King, R.B. Sliding Contact Stresses in A Two-Dimensional Layered Elastic Half-Space / R.B. King, T.C. Osullivan // International Journal of Solids and Structures. - 1987. - Vol. 23(5). - Pp. 581-597. - DOI:https://doi.org/10.1016/0020-7683(87)90019-9.
20. Tsui, T.Y. Influences of Stress on the Measurement of Mechanical Properties Using Nanoindentation: Part 1. Experimental Studies in an Aluminum Alloy / T.Y. Tsui, W.C. Oliver, G.M. Pharr // Journal of Materials Research. - 1996. - Vol. 11(3). - Pp. 752-759. - DOI:https://doi.org/10.1557/JMR.1996.0091.
21. Bolshakov, A. Influences of Stress on the Measurement of Mechanical Properties Using Nanoindentation: Part 2. Finite Element Simulations / A. Bolshakov, W.C. Oliver, G.M. Pharr // Journal of Materials Research. - 1996. - Vol. 11(3). - Pp. 760-768. - DOI:https://doi.org/10.1557/JMR.1996.0092.
22. Hainsworth, S.V. Analysis of nanoindentation load-displacement loading curves / S.V. Hainsworth, H.W. Chandler, T.F. Page // Journal of Materials Research. - 1996. - Vol. 11(8). - Pp. 1987-1995. - DOI:https://doi.org/10.1557/JMR.1996.0250.
23. Berriche, R. Vickers Hardness from Plastic Energy / R. Berriche // Scripta Metallurgica et Materialia. - 1995. - Vol. 32(4). - Pp. 617-620. - DOI:https://doi.org/10.1016/0956-716X(95)90847-D.
24. Li, X. D.; Bhushan, B. A Review of Nanoindentation Continuous Stiffness Measurement Technique and Its Applications / X.D. Li, B. Bhushan // Materials Characterization. - 2002. - Vol. 48(1). - Pp. 11-36. - DOI:https://doi.org/10.1016/S1044-5803(02)00192-4.
25. Hohlova, Yu. Indentirovanie ot makro- do nano- i primery issledovaniy svoystv materialov s osoboy strukturoy / Yu. Hohlova, M. Hohlov // Paton Electric Welding Institute of NAS of Ukraine. - 2016. - № 12. - DOI:https://doi.org/10.13140/RG.2.2.22072.96008.
26. Ignatovich, S.R. Opredelenie mikromehanicheskih harakteristik poverhnosti materialov s ispol'zovaniem nanoindentometra «Mikron-gamma» / S.R. Ignatovich, I.M. Zakiev, V.I. Zakiev // Vestnik Har'kovskogo nacional'nogo avtomobil'no-dorozhnogo universiteta. - 2008. - T. 42. - S. 86-89.
27. GOST R 8.748-2011. Gosudarstvennaya sistema obespecheniya edinstva izmereniy. Metally i splavy. Izmerenie tverdosti i drugih harakteristik materialov pri instrumental'nom indentirovanii. Chast' 1. Metod ispytaniy : data vvedeniya 2011.12.13. - Moskva : Standartinform, 2013. - 28 s.
28. Oliver, W.C. Mesurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology / W.C. Oliver, G.M. Pharr // Journal of Materials Research. - 2004. - Vol. 19, № 1. - DOI:https://doi.org/10.1557/jmr.2004.19.1.3.
29. Size Effects of Hardness and Strain Rate Sensitivity in Amorphous Silicon Measured by Nanoindentation / D.M. Jarzabek, M. Milczarek, S. Nosewicz [et al.] // Metallurgical and Materials Transactions A. - 2020. - Vol. 51. - Pp. 1625-1633. - DOI:https://doi.org/10.1007/s11661-020-05648-w.
30. Freund, L.B. Thin Film Materials: Stress, Defect Formation and Surface Evolution / L.B. Freund, S. Suresh // Cambridge University Press: Cambridge, 2003. - 820 p.
31. Ohring, M. Materials Science of Thin Films, Deposition and Structure / M. Ohring // Academic Press: San Diego, CA, 2002. - 808 p.
32. Nix, W.D. Mechanical-Properties of Thin-Films / W.D. Nix // Metallurgical Transactions A. - 1989. - Vol. 20(11). - Pp. 2217-2245. - DOI:https://doi.org/10.1007/BF02666659.
33. Jankowski, A.F. Effects of Deflection on Bulge Test Measurements of Enhanced Modulus in Multilayered Films / A.F. Jankowski, T. Tsakalakos // Thin Solid Films. - 1996. - Vol. 291. - Pp. 243-247. - DOI:https://doi.org/10.1016/S0040-6090(96)09031-1.
34. Small, M.K. Analysis of the Accuracy of the Bulge Test in Determining the Mechanical-Properties of Thin-Films / M.K. Small, W.D. Nix // Journal of Materials Research. - 1992. - Vol. 7 (6). - Pp. 1553-1563. - DOI:https://doi.org/10.1557/JMR.1992.1553.
35. Liechti, K. M. Large-Scale Yielding in Blister Specimens / K.M. Liechti, A. Shirani // International Journal of Fracture. - 1994. - Vol. 67 (1). - Pp. 21-36. - DOI:https://doi.org/10.1007/BF00032362.
36. Pressure and friction dependent mechanical strength - cracks and plastic flow / D.A. Wiegand, B. Redingius, K. Ellis, C. Leppard // International Journal of Solids and Structures. - 2011. - Vol. 48, I. 11-12. - Pp. 1617-1629. - DOI:https://doi.org/10.1016/j.ijsolstr.2011.01.025.
37. Gusev, E. Investigating Mechanical Strength of Multilayer Membranes for MEMS Converters of Physical Quantities / Gusev, E., Dedkova, A. Djuzhev // Nanoindustry Russia. - 2018. - № 1. - Pp. 538-541. - DOI:https://doi.org/10.22184/1993-8578.2018.82.538.541.
38. Jinling, Y. Fracture Properties of LPCVD Silicon Nitride and Thermally Grown Silicon Oxide Thin Films from the Load-Deflection of Long Si3N4 and SiO2/Si3N4 Diaphragms / Y. Jinling, G. João, P. Oliver // Journal of Microelectromechanical Systems. - 2008. - Vol. 17, I. 5. - Pp. 1120-1134. - DOI:https://doi.org/10.1109/JMEMS.2008.928706.
39. Venkatraman, R. Separation of film thickness and grain boundary strengthening effects in Al thin films on Si / R. Venkatraman, J.C. Bravman, // Journal of Materials Research. - 1992. - Vol. 7, I. 8. - Pp. 2040-2048. - DOI:https://doi.org/10.1557/JMR.1992.2040.
40. Experimental Determination of Mechanical Properties of the Anode Cell of an X-Ray Lithograph / N. Djuzhev, E. Gusev, A. Dedkova [et. al.] // Technical Physics. - 2020. - Vol. 65(11). - Pp. 1755-1759. - DOI:https://doi.org/10.1134/S1063784220110055.
41. Petersen, K.E. Youngs Modulus Measurements of Thin-Films Using Micromechanics / K.E. Petersen, C.R. Guarnieri // Journal of Applied Physics. - 1979. - Vol. 50 (11). - Pp. 6761-6766. - DOI:https://doi.org/10.1063/1.325870.
42. Osterberg, P. M. M-TEST: A Test Chip for MEMS Material Property Measurement Using Electrostatically Actuated Test Structures / P.M. Osterberg, S.D. Senturia // Journal of Microelectromechanical Systems. - 1997. - Vol. 6 (2). - Pp. 107-118. - DOI:https://doi.org/10.1109/84.585788.
43. Mechanical Deflection of Cantilever Microbeams - A New Technique for Testing the Mechanical-Properties of Thin-Films / T.P. Weihs, S. Hong, J.C. Bravman, W.D. Nix // Journal of Materials Research. - 1988. - Vol. 3 (5). - Pp. 931-942. - DOI:https://doi.org/10.1557/JMR.1988.0931.
44. Mönig, R. Thermal Fatigue Testing of Thin Metal Films / R. Mönig, R.R. Keller, C.A. Volkert, // Review of Scientific Instruments. - 2004. - Vol. 75 (11). - Pp. 4997-5004. - DOI:https://doi.org/10.1063/1.1809260.
45. Microstructure Evolution During Alternating-Current-Induced Fatigue / R.R. Keller, R.H. Geiss, Y.-W. Cheng, D.T. Read // Proceedings of the International Mechanical Engineering Conference and Exposition 2004. - American Society of Mechanical Engineers, 2004. - Pp. 107-112.
46. Geiss, R.H. TEM Study of Dislocation Loops in Deformed Aluminium Films / R.H. Geiss, D.T. Read, R.R. Keller // Microscopy and Microanalysis. - 2005. - Vol. 11 (S02). - Pp. 1870-1871. - DOI:https://doi.org/10.1017/S1431927605508626.
47. Strain-Induced Grain Growth During Rapid Thermal Cycling of Aluminum Interconnects / R.R. Keller, R.H. Geiss, N. Barbosa [et al.] // Metallurgical and Materials Transactions A. - 2007. - Vol. 38 (13). - Pp. 2263- 2272. - DOI:https://doi.org/10.1007/s11661-006-9017-1.
48. The Effect of Ion Beam Etching on Mechanical Strength Multilayer Aluminum Membranes / E.E. Gusev, A.V. Borisova, A.A. Dedkova, A.A. Salnikov, V.Y. Kireev // 2019 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus). - 2019. - Pp. 1990-1994. - DOI:https://doi.org/10.1109/eiconrus.2019.8657243.
49. Vlasov, A.I. Analiz vliyaniya formy membrany na mehanicheskuyu prochnost' i stabil'nost' parametrov MEMS-sensorov davleniya / A.I. Vlasov, T.A. Civinskaya, V.A. Shahnov // Problemy razrabotki perspektivnyh mikro- i nanoelektronnyh sistem (MES). - 2016. - № 4. - S. 65-70.
50. Microscopis strength of silicon partiles in an aluminium-silicon alloy / M.G. Mueller, M. Fornabaio, G. Zagar, A. Mortensen // Acta Materialia. - 2016. - Vol. 105(15). - Pp. 165-175. - DOI:https://doi.org/10.1016/j.actamat.2015.12.006.
51. Clemens, B.M. Structure and Strength of Multilayers / B.M.Clemens, H. Kung, S.A. Barnett // MRS Bulletin. - 1999. - Vol. 24. - Pp. 20-26. - DOI:https://doi.org/10.1557/S0883769400051502.
52. Morris, M.A. The effect of geometrically necessary dislocations on grain refinement during severe plastic deformation and subsequent annealing of Al-7% Si / M.A. Morris, I. Gutierrez-Urrutia, D.G. Morris, // Materials Science and Engineering A. - 2008. - Vol. 493. - Pp. 141-147. - DOI:https://doi.org/10.1016/j.msea.2007.07.096.